New IEC Connector with Dual Locking Systems

Schaffer recently announced the new IEC power connectors which is a new addition that will scale up the power sector. The international leader who works in the electromagnetic compatibility and power quality sector said that he was awed by this innovation. The new IEC connector, known as the ILI3P-S, is a two-locking power connector that is in the group C14/C20 […]

SiC Plasma Epi-prep Might Overtake the Existing CMP Process

The SiC plasma polishing system is a new introduction by Oxford Instruments. The system is set to provide clean, higher-yield, sustainable, and affordable options for the CMP method. This introduction will be a huge gain in SiC power semiconductor devices because various advancements will be noted while trust will be reinforced. When comparing the system with the traditional CMP-prepared wafers, […]